Here it is, the S3X58-G801. A new high performance general application solder paste without restraints from reflow profile
With high balanced performance in void reduction and printability/wettability improvement forversatile application
- Reduces void occurrence regardless of component type or reflow profile
- Retains the print geometry, higher first pass yield
- Good wetting performance to a wide range of materials
Setting the Printer parameters for fine-pitch printing?